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Automated Production

Standardized process modules for bonding

Does your microfluidic device require bonding and do you prefer to do high-volume manufacturing in-house? 

Bondus can offer its bonding equipment as a process module, to be implemented with your manufacturing line. This is available for both Bondus direct bonding and UV adhesive bonding. 

Our way of working allows for early technology de-risking by performing a validation study first. We can then design, build and realize a turn-key delivery of the bonding equipment. 

Bonding modules generally have a 200mm build width, allowing for space-efficient integration with for example indexing tables or transfer systems. 


Bonding Technolog​​ies

Customized Solutions

Contact us to request tailored manufacturing solutions that meet the specific needs of your application or industry. 
Whether production volumes are low or high, we can create scalable modules to fit your requirements.

Contact us​​