Automated Production
Standardized process modules for bonding
Does your microfluidic device require bonding and do you prefer to do high-volume manufacturing in-house?
Bondus can offer its bonding equipment as a process module, to be implemented with your manufacturing line. This is available for both Bondus direct bonding and UV adhesive bonding.
Our way of working allows for early technology de-risking by performing a validation study first. We can then design, build and realize a turn-key delivery of the bonding equipment.
Bonding modules generally have a 200mm build width, allowing for space-efficient integration with for example indexing tables or transfer systems.
